Applications: Beam-type vibration sensors for vehicle alarms, Solid state switches for counters, Momentary closure type switches

　　Description: The ‘L’ in LDT Series stands for ‘laminated’ sensor. Typically, a 0.005” (125μm) polyester layer is laminated to a 28 μm or 52μm piezo film element. When used in a ‘bending’ mode, laminated film elements develop much higher voltage output when flexed than a non-laminated DT elements series. The neutral axis is in the laminate instead of in the film so the film is strained more when flexed. The capacitance is proportional to the area and inversely proportional to the thickness of the element. Piezo film sensors LDT elements are available in a variety of lead attachment options. For significantly increased sensitivity, the LDTM-028K (M-Mass) combines an LDT0-028K form factor with the addition of a 0.72 gram round mass. The LDT1, 2 and 4 have 12” of 26 gauge twisted pair wire. The LDT0-028K and LDTM-028K with solder tabs can be soldered directly to a PCB with a reasonable level of care. Piezo film cannot withstand high temperatures (>80°C), and therefore soldering of the pins to a PCB must be done quickly. A heatsink clamped to the interface area between the film and the crimps will take the heat away from the film. Pre-tin the PCB and then quickly solder the sensor to the board. Do not allow the soldering iron to touch the film, and do not use a dwell time of over 5 seconds on the pins. Low temperature solders can also be used. For tightly tolerance sensitivity requirements, please consult Measurement Specialties for techniques used to control variations of boundary conditions in production.

　　Features:

　　The ‘L’ in LDT stands for ‘laminated’ sensor
　　When used in a ‘bending’ mode, laminated film elements develop much higher voltage output than a non-laminated DT elements series
　　Available in a variety of lead attachment options
　　LDT0-028K and LDTM-028K with solder tabs can be soldered directly to a PCB with a reasonable level of care

　　典型应用: 振动报警传感器，固态开关计数器，瞬时闭合式开关

　　产品描述:

　　"L"在LDT系列中代表聚酯薄膜基片，通常是把0.005”（125μm）的聚酯薄膜和28 μm 或 52μm的压电薄膜层压而成。在弯曲压电薄膜时，带层压基片的薄膜元件比不带层压基片的DT系列元件产生更高的电压输出。LDT系列的中性轴在聚酯基片上，而不在压电薄膜上，因此弯曲时薄膜的张力更大。电容与元件面积成正比例，与元件厚度成反比例。传感器有多种引线可供选择。为大幅度提高灵敏度，LDTM-028K（M代表质量块）在LDT0-028K上外加0.72克的圆形质量块。LDT1，2和4 带有12"长的26号双绞线。LDT0-028K和LDTM-028K带有焊接引脚，可直接焊接到PCB上。元件不能承受高温（> 80°C），因此焊接需要迅速完成。夹在压电薄膜和连接头连接处的散热器能迅速把热量带走。提前给插针上锡，然后迅速焊接到电路板上。不要用烙铁接触压电薄膜，焊接时间也不能超过5秒钟。可用低温焊接。对于需要高灵敏度的应用，请联系我们获得技术支持。

　　特点:

　　L在LDT中代表层压聚酯薄膜基片
　　层压薄膜元件在被弯曲时比非层压的DT系列产生更高的电压输出
　　带有焊接引脚的LDT0-028K和LDTM-028K可直接焊接到PCB上

　　LDT系列传感器更多技术参数及规格书下载请浏览：http://www.sensorway.cn/sensors/118.html

　　北京赛斯维测控技术有限公司产品咨询热线：010-84775646，84775648。